Price:
$4.55
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For just $4.55 , buy Bumblebee Stencils IC Chip BGA Reballing Stencil Solder Template for iPhone XS/XS Max /XR from the wholesale webshop online.
Product Description
Specifications
Product Description
Bumblebee Stencils IC Chip BGA Reballing Stencil Solder Template for iPhone XS/XS Max /XR
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Imported alloy steel, high-temperature resistant and wear-resistant
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Designed specifically for mobile phone chips, it can make each solder ball round and full, meeting the needs of tin planting for various chips
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Easy and quickly for reballing the BGA IC
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Excellent to replace IC or BGA rework reballing
Compatible with:
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iPhone XS/XS Max /XR
Package included:
- 1 x Reballing Stencil
Specifications
| Gross Weight | 0.018kg |
|---|---|
| Volume Weight | 0.005kg |
| Package Length | 19.500cm |
| Package Width | 12.000cm |
| Package Height | 0.100cm |
| Package Weight | 0.016kg |
| With Retail Packaging | Yes |