Price:
$4.55

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For just $4.55 , buy Bumblebee Stencils IC Chip BGA Reballing Stencil Solder Template for iPhone 11/11 Pro/11 Pro Max from the wholesale webshop online.

Product Description

Bumblebee Stencils IC Chip BGA Reballing Stencil Solder Template for iPhone 11/11 Pro/11 Pro Max
  • Imported alloy steel, high-temperature resistant and wear-resistant

  • Designed specifically for mobile phone chips, it can make each solder ball round and full, meeting the needs of tin planting for various chips

  • Easy and quickly for reballing the BGA IC

  • Excellent to replace IC or BGA rework reballing

Compatible with:

  • iPhone 11 Pro 5.8 inch

  • iPhone 11 Pro Max 6.5 inch

  • iPhone 11 6.1 inch

Package included:

  • 1 x Reballing Stencil

Specifications

Gross Weight 0.024kg
Volume Weight 0.027kg
Package Length 20.000cm
Package Width 12.000cm
Package Height 0.500cm
Package Weight 0.021kg
With Retail Packaging Yes
Bumblebee Stencils IC Chip BGA Reballing Stencil Solder Template for iPhone 11/11 Pro/11 Pro Max-1
Bumblebee Stencils IC Chip BGA Reballing Stencil Solder Template for iPhone 11/11 Pro/11 Pro Max-2
Bumblebee Stencils IC Chip BGA Reballing Stencil Solder Template for iPhone 11/11 Pro/11 Pro Max-3
Bumblebee Stencils IC Chip BGA Reballing Stencil Solder Template for iPhone 11/11 Pro/11 Pro Max-4

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